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Soldering Paste

  • Product Name: Soldering Paste

  • Country of Origin: China

  • Weight (kg): 0.2 kg

  • Material: Soldering paste

  • Particle size: 25-45

  • Melting Point (°C): 183°C


Description

The solder joints are bright, suitable for high precision and demanding applications. There is minimal residue after tinning, excellent resistance to oxidation, and corrosion resistance.

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The specially formulated thick paste is smooth and does not adhere to the metal. The viscosity is moderate, and the printed chip components do not collapse or shift.

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Various types of particles can easily be soldered. Details determine success or failure. Careful craftsmanship is essential.

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