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Soldering Paste

  • Product Name: Soldering Paste

  • Country of Origin: China

  • Weight (kg): 0.03kg

  • Material: Pine resin

  • Granularity: T4

  • Melting Point (°C): 120°C – 250°C


Description

The formula requires no cleaning, resulting in clean and shiny solder joints. It is suitable for welding high-precision components and is less likely to cause electrical leakage or corrosion issues over an extended period of use.

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The syringes are individually packaged, allowing for controlled use of materials and minimizing waste. The viscosity is moderate, ensuring that components do not collapse or shift during printing and mounting operations, thereby improving production yield.

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Wide temperature range compatibility, high versatility. Suitable for various welding processes such as high- and medium-temperature reflow soldering, BGA repair tables, and chip tinning.

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